Effects of phosphorus content on generation and growth of cracks in nickel–phosphorus platings owing to thermal cycling

We observed crack generation and structural changes in electroless nickel–phosphorus (Ni–P) plating layers formed on copper-metalized silicon nitride substrates both during thermal cycling from ? 40 to 250 °C and during storage (not cycling) at 250 °C in order to investigate the effect of the phosphorus contents on crack generation and growth in the Ni–P platings. The used platings contained phosphorus at three different contents: 2.1 wt% Ni–P(low)], 6.5 wt% Ni–P(med)], and 10.9 wt% Ni–P(high)]. The generation time and the amount of cracks were strongly dependent on their phosphorus contents. More cracks appeared after thermal cycling than after storage at 250 °C. In Ni–P(low), cracks were generated after 200 thermal cycles, whereas no cracks were observed even after 250 h of storage at 250 °C. In Ni–P(med) and Ni–P(high), both during thermal cycling and storage at 250 °C, cracks formed during or after crystallization of the amorphous layers. These results suggest that the primary factors affecting the generation of cracks in electroless Ni–P platings are crystallization of the Ni–P platings and repeated changes in thermal stress.