Improved microstructure and ohmic contact of Nb electrode on n-type 4H-SiC

Niobium was deposited as an electrode material on an n-type SiC wafer for power device application. The reaction microstructure and electrical contact property were investigated after annealing at 700 to 1000 °C and compared with the results for an Ni electrode. Microstructure-related problems of the Ni electrode could be resolved without sacrificing ohmic contact behavior with a low contact resistivity of 1.53 × 10^− 4 Ω cm². Carbon precipitation was completely eliminated with Nb by the formation of carbides, leading to good adhesion upon wire bonding process. At the reaction interface, Nb₅Si₃ was formed in an epitaxial relationship with SiC, leading to a good interface contact property as well as good interface adhesion.