Effect of seed layer stress on the fabrication of monolithic MEMS microstructure |
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Authors: | C K Chung Y J Fang C M Cheng Y Z Hong C H Wang |
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Affiliation: | (1) Department of Mechanical Engineering, National Cheng Kung University, Tainan, 701, Taiwan, ROC;(2) Industrial Technology Research Institute, HsinChu, 310, Taiwan, ROC;(3) Department of Engineering and System Science, National Tsing Hua University, Tsing Hua, 300, Taiwan, ROC |
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Abstract: | This paper reported the effect of seed layer stress on the fabrication of monolithic polymer-metal MEMS microstructure and
what is a better material for the seed layer. The monolithic microstructure is gaining more and more attentions in MEMS application,
especially in three-dimensional microstructure and inkjet printhead. The polymer–metal MEMS microstructure can be fabricated
by combining the lithography and electroforming technologies. It is an integrated technology by batch process at low cost.
The metal seed layer with large stress will lead to cracks and failure during the process integration. Several metal materials
and thicknesses were studied to find a better candidate as the seed layer for the monolithic MEMS microstructure. The relationship
between the monolithic MEMS structure and seed layer selection is also discussed. The lower residual stress of seed layer
will result in a better surface condition for the followed integration process. The pure Ti metal and two-layer Ti/Au composite
are the better seed layer materials in this study for the followed electroforming process of the monolithic polymer-metal
MEMS microstructure. |
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