| 磁控溅射镀膜的原理与故障分析 |
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| 引用本文： | 郝晓亮. 磁控溅射镀膜的原理与故障分析[J]. 电子工业专用设备, 2013, 0(6): 57-60 |
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| 作者姓名： | 郝晓亮 |
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| 作者单位： | 中国电子科技集团公司第十三研究所 |
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| 摘 要： | 介绍了磁控溅射镀膜的种类及特点。以直流磁控溅射为例,介绍了其结构、原理,分析了影响磁控溅射工艺稳定性的因素。最后总结了磁控溅射镀膜工艺中常见的故障以及解决方法。
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| 关 键 词： | 物理气象淀积 磁控溅射 故障分析 镀膜工艺 |
The Principle and Fault Diagnosis of Magnetron Sputtering Deposition |
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| HAO Xiaoliang. The Principle and Fault Diagnosis of Magnetron Sputtering Deposition[J]. Equipment for Electronic Products Marufacturing, 2013, 0(6): 57-60 |
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| Authors: | HAO Xiaoliang |
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| Affiliation: | HAO Xiaoliang(The 13thResearch Institute of CETC,Shijiazhuang 050051,China) |
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| Abstract: | This paper introduces the type of Magnetron SputteringDeposition.The features of every types are analyzed.An example of Direct Current Magneton Sputtering Deposition is given to show the structure and principle of Magetron Sputtering.The factors that can affect the stability of Magnetron Sputtering process are qualitatively analyzed.Finally, the normal faults and solutions of Magnetron Sputtering process are summarized. |
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| Keywords: | Physical vapor deposition （PVD） Magnetron sputtering deposition Fault diagnosis Deposition process |
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