| 填料型高导热复合材料的研究现状与发展趋势 |
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| 引用本文： | 秦典成.填料型高导热复合材料的研究现状与发展趋势[J].化工新型材料,2020,48(3):23-28. |
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| 作者姓名： | 秦典成 |
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| 作者单位： | 乐健科技(珠海)有限公司,广东省LED封装散热基板工程技术研究中心,珠海519180 |
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| 摘 要： | 填料型导热复合材料是LED等半导体在封装及使用过程中一种常见的散热材料,它利用高导热填料填充具有密度小、可加工性能好、成本低廉等优点的高分子聚合物制备而成,对降低半导体器件的结温、增强其综合特性大有裨益。简要概述了近年来填料型导热复合材料的研究现状,并对其发展趋势进行了预测,以期为LED的实际散热需要提供技术参考,进而推动LED产业的发展。
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| 关 键 词： | 填料 导热 复合材料 LED 半导体 聚合物 封装 散热 |
Review of filler reinforced composite with high thermal conductivity |
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| Qin Diancheng.Review of filler reinforced composite with high thermal conductivity[J].New Chemical Materials,2020,48(3):23-28. |
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| Authors: | Qin Diancheng |
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| Affiliation: | (Rayben Technologies(Zhuhai)Limited,Guangdong LED Package-used Heat Dissipation Substrate Engineering Technology Research Center,Zhuhai 519180) |
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| Abstract: | Thermally conductive filler enforced composites,which are prepared using fillers of high thermal conductivity to fill low density,favorable processibility and low cost Polymers,are greatly conducive to reduced junction temperature and enhanced comprehensive performance of semiconductor devices.A review of thermally conductive filler composites was presented,expecting to provide LED packaging with technical reference for heat dissipation purpose.Thus facilitated the progress of LED industry. |
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| Keywords: | filler thermal conductivity composite LED semiconductor polymer packaging heat dissipation |
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