| 无铅焊料在清华大学的研究与发展 |
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| 引用本文： | 马莒生,陈国海.无铅焊料在清华大学的研究与发展[J].电子元件与材料,2004,23(11):45-48. |
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| 作者姓名： | 马莒生 陈国海 |
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| 作者单位： | 清华大学材料科学与工程系,北京,100084;清华大学材料科学与工程系,北京,100084 |
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| 摘 要： | 清华大学材料科学与工程系电子材料与封装技术研究室研制了6个系列的无铅焊料:Sn-3.5Ag添加Cu或Bi; Sn-3.5Ag-1.0Cu添加In或Bi; Sn-Ag-Cu-In添加Bi; Sn-Ag-Cu添加Ga; Sn-Zn添加Ga; Sn-Zn添加多种元素。重点介绍了Sn-Zn添加多种元素。对6个系列无铅焊料的研究取得了较好的实验结果,得到比较理想的低温焊料体系,有的合金熔点已非常接近铅锡共晶焊料熔点183℃。
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| 关 键 词： | 金属材料 无铅焊料 熔点 研究与发展 |
| 文章编号： | 1001-2028(2004)11-0045-04 |
R&D of Lead-free Solder In Tsinghua University |
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| MA Ju-sheng,CHEN Guo-hai.R&D of Lead-free Solder In Tsinghua University[J].Electronic Components & Materials,2004,23(11):45-48. |
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| Authors: | MA Ju-sheng CHEN Guo-hai |
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| Abstract: | Six series of lead-free solder alloys have been investigated by School of Material Science & Engineering of Tsinghua University: Sn-3.5Ag addition Cu and Zn system, Sn-3.5Ag-1.0Cu addition In and Bi system, Sn-Ag-Cu-In-Bi system, Sn-Ag-Cu addition Ga system, Sn-Zn addition Ga system and Sn-Zn addition 4 elements system, especially the last one. Results indicate that melting point for some lead-free solders can be decreased to fewer than 200C and those lead-free alloying solders have excellent application characteristics. |
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| Keywords: | metal materials lead-free solder melting point research and development |
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