玻璃平面波导的热键合制备与界面扩散研究

铒镱共掺磷酸盐玻璃平面波导在散热和抑制非线性效应方面具有独特优势，可开发作为近红外1.5 μm高平均功率固体激光器的增益介质，具有重要意义。文中应用光胶热键合方法制备铒镱共掺磷酸盐玻璃平面波导，研究了预键合阶梯升温过程对键合质量的影响。通过电子探针表面分析（EPMA）得到键合温度和键合时间对键合界面分子扩散层厚度的影响，并根据Fick第二定律，探讨了一维等效假设下的芯层玻璃中的Yb3+扩散机理，建立了热键合过程中的固-固界面分子扩散模型。最终通过选择最优的热处理工艺参数，得到了键合质量良好且键合强度达到11.63 MPa的芯层厚度为100 μm的三明治结构平面波导。

Thermal bonding preparation and interfacial diffusion research of glass planar waveguides

Erbium-ytterbium co-doped phosphate glass planar waveguides have unique advantages in heat dissipation and nonlinear effect suppression. It can be developed as the gain medium of near-infrared 1.5 μm high average power solid lasers, which is of great significance. Erbium-ytterbium co-doped phosphate glass planar waveguides are fabricated by optical contacting and thermal bonding. The effect of pre-bonding step-temperature on bonding quality is studied. At the same time, the influence of bonding temperature and bonding time on the thickness of molecular diffusion layer at bonding interface is obtained by electron probe surface analysis (EPMA). According to Fick's second law, the diffusion mechanism of Yb3+ in core glass under one-dimensional equivalence hypothesis is discussed, and the molecular diffusion model of the solid-solid interface during bonding process is established. Finally, a high-quality sandwich structure planar waveguide with 100 μm core layer and bonding strength of 11.63 MPa is obtained by selecting optimal heat treatment temperature curve.