浓度响应型水触变材料及在含水漏层堵漏技术的应用

常规堵漏浆易被地层水稀释、置换或冲走，稳定性发生破坏，导致封堵失败，含水漏失层的堵漏一直是世界性难题。为此，研发了一种浓度响应型水触变堵漏剂，其包括浓度响应处理剂SMF及增溶剂SMZ，水触变剂的水溶液流动性好，对混入的水有一定容纳限，在容纳限以内仍能保持好的流变性与稳定性，但当水的混入量超过容纳限后SMF便发生自聚合，沉淀生成具有一定黏稠、挂壁性强和可变性的三维网状结构半固体凝胶，浓度响应范围和容纳限均可以通过调整2种处理剂的配比和加量进行调控，进而研制了新型水触变堵漏技术。水触变桥接堵漏浆能够在流水下滞留，滞留物在水中的黏结力达到1.166 MPa，达到专用黏结剂在空气条件下的黏结能力；水触变固结堵漏浆不被地层水稀释且能在水中固化。该技术在SHB5-15H井应用中成功封堵了含水漏层，且配制简单、安全性好，水下滞留能力强，为解决含水漏层的封堵问题提供了一种便捷安全高效的新型堵漏技术，具有很好的应用前景。 

Study on Concentration Responsive Water Thixotropic Material and Plugging Technology of Water Bearing Leakage Layer

The conventional plugging slurry is easy to be diluted、replaced or washed away by formation water, so plugging in containing water formation is a worldwide problem. Therefore, a concentration responsive water thixotropic plugging agent has been developed, which including concentration responsive treatment agent SMF and solubilizer SMZ. The solution of water thixotropic agent has good fluidity, has a certain limition for the mixed water, and can still maintain good rheology and stability within the tolerance limition. However, when the water exceeds the tolerance limition, SMF will change to three dimensional network structure semisolid gels which has certain hardness、viscosity by self polymerize. Concentration response range and Limition of water can be adjusted by adjusting the ratio and dosage of SMF and SMZ, and a new water thixotropic plugging technology is developed. The water thixotropic bridging plugging slurry can be retained under flowing water, and the adhesion of the retained material in water reaches 1.166 MPa. Water thixotropic consolidation plugging slurry is not diluted by formation water and can be solidified in water. The plugging technology has applicated in SHB5-15H well,and successfully blocks the water bearing leakage layer. The plugging technology is simple preparated, and has good safety and strong underwater retention capacity. It provides a convenient、safe and efficient new plugging technology to solve the plugging problem of water bearing leakage layer, and has a good application prospect.