| 平面凸点式封装(FBP) |
| |
| 引用本文： | 谢洁人. 平面凸点式封装(FBP)[J]. 电子与封装, 2005, 5(12): 6-9 |
| |
| 作者姓名： | 谢洁人 |
| |
| 作者单位： | 江苏长电科技股份有限公司,江苏,无锡,214431 |
| |
| 摘 要： | QFN工艺(Quad Flat No-lead)在封装过程中大多存在着焊线牢度不够、包封溢胶、切 割毛刺等缺陷,FBP(Flat Bump Package)的出现不仅很好地解决了QFN的缺陷,而且FBP产品 在SMT工艺中能表现出更优良的特性。文章主要介绍了FBP的设计思路、结构特点、主要工艺流 程、关键工艺和衍生产品等。
|
| 关 键 词： | QFN封装 FBP封装 产品可靠性 蚀刻 化学镀镍金 |
| 文章编号： | 1681-1070（2005）12-06-04 |
| 收稿时间： | 2005-09-02 |
| 修稿时间： | 2005-09-02 |
Flat Bump Package |
| |
| Xie Jie-ren. Flat Bump Package[J]. Electronics & Packaging, 2005, 5(12): 6-9 |
| |
| Authors: | Xie Jie-ren |
| |
| Affiliation: | Jiangsu Changjiang Electronics Technology Co., Ltd. Jiangsu Wuxi 214431 China |
| |
| Abstract: | In QFN ( Quad Flat No-lead ) package, there're many issues during the assembly process, such as the weak bondability between the bond wires and the inner leads in W/B process, resin bleeding in Molding process, copper burr in Unit Sawing process, etc. FBP ( Flat Bump Package ) not only solves those problems, but also its bondability with PCB is excellent in SMT process. This paper will introduce total solution of QFN process issues, structure of FBP, FBP features, FBP key process, FBP ramification and so on. |
| |
| Keywords: | QFN FBP Reliability Etching Chemical Plating |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
