The effect of bonding force on the electrical performance and reliability of NCA joints processed at a lowered temperature |
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Authors: | Y?Ma Email author" target="_blank">Y?C?ChanEmail author |
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Affiliation: | (1) Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong |
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Abstract: | The effect of the bonding force during flip chip-on-flex (FCOF) assembly on the electrical performance of the nonconductive
adhesive (NCA) interconnects was investigated in this study, under the precondition of a reduced processing temperature in
order to minimize thermally-induced damage to the low-cost flexible substrates. Pressure cooker tests (PCT) were performed
to assess the reliability performance of the adhesive joints in high temperature and high humidity conditions. The assembly
process was modified and the processing temperature and the bonding force were adjusted according to the experimental results
to enable the use of low cost substrates, such as poly(ethylene terephthalate) (PET) materials in smart card fabrication. |
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