Improvement of Elastic Modulus and Thermal Stability of Epoxy Resin Using New Curing Agents |
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| Authors: | R Kirithick U S Lakshmipati M Ambarish K Vignesh Maharaaj |
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| Affiliation: | 1. Department of Mechanical Engineering , Sri Ramakrishna Institute of Technology , Pachapalayam , Coimbatore , India mekiekrithik92@gmail.com;3. Department of Mechanical Engineering , Sri Ramakrishna Institute of Technology , Pachapalayam , Coimbatore , India |
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| Abstract: | New curing agents 2,5-diamino-1,3,4-thiadiazole (DATD) and N-(4-hydroxybenzal) N'(4′-hydroxyphenyl) thiourea (HHPT) were synthesised and characterized using FT-IR, 1H-NMR and 13C-NMR analysis. The curing reactions were studied for the epoxy resin diglycidyl ether of bisphenol-A (DGEBA) using new curing agents along with the conventional aromatic diamine 4,4′-diamino diphenyl methane (DDM) for comparison purpose. The curing profiles of DDM, DATD and DATD/HHPT towards DGEBA were examined by Differential Scanning Calorimetry (DSC). Elastic modulus and thermal stability of the cured resins were evaluated using DMA and TGA analysis. When compared with DDM and DATD, the DATD/HHPT curing system accelerated the curing rate due to the presence of phenol molecules in the HHPT. Furthermore, the DATD/HHPT-cured epoxy resin demonstrated higher elastic modulus along with better thermal stability. |
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| Keywords: | Curing 2 5-diamino-1 3 4-thiadiazole N-(4-hydroxybenzal)n'(4'hydroxyphenyl) thiourea Diglycidyl ether of bisphenol-A Elastic modulus Thermal stability |
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