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离心高速电镀镍工艺研究
引用本文:邵光杰,马焕明,王海燕,荆天辅,姚枚.离心高速电镀镍工艺研究[J].电镀与涂饰,2000,19(2):10-12.
作者姓名:邵光杰  马焕明  王海燕  荆天辅  姚枚
作者单位:燕山大学,材料化工学院,河北,秦皇岛,066004
基金项目:河北省自然科学基金!资助项目 (5992 37)
摘    要:为提高电镀镍的沉积速率以提高劳动生产率 ,采用自行研制的离心高速电镀镍装置。研究了电流密度与沉积速率、晶粒尺寸及镀层硬度的关系 ,结果表明 :采用此装置 ,镀液在阴极表面切向流速、极限电流密度及沉积速率均增大 ,使得镀层晶粒更细致 ,硬度更高。

关 键 词:电镀  镀镍  工艺  镀层

Study of centrifugal high-speed nickel plating
SHAO Guang-jie,MA Huan-ming,WANG Hai-yan,JING Tian-fu,YAO Mei.Study of centrifugal high-speed nickel plating[J].Electroplating & Finishing,2000,19(2):10-12.
Authors:SHAO Guang-jie  MA Huan-ming  WANG Hai-yan  JING Tian-fu  YAO Mei
Abstract:The purpose of this article was to increase the deposition rate of mickel plating so as to improve the productivity. Self-developed centrifugal nickel plating equipment was adopted, the effect of current density on deposition rate, grain size and deposit hardness were studied. The results show that tangential flow of electrolyte at cathode surface, limited current density and deposition rate are increased, which refines the grain size and improves the deposition hardness.
Keywords:nickel  electroplating  centrifugal  high speed
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