Microstructure Development of Mechanical-Deformation-Induced Sn Whiskers |
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Authors: | Shih-Kang Lin Yuhi Yorikado Junxiang Jiang Keun-Soo Kim Katsuaki Suganuma Sinn-Wen Chen Masanobu Tsujimoto Isamu Yanada |
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Affiliation: | (1) Department of Chemical Engineering, National Tsing Hua University, Hsin-chu, 300, Taiwan;(2) Institute of Scientific and Industrial Research, Osaka University, Ibaraki Osaka, 567-0047, Japan;(3) C. Uyemura & Co., Ltd, Chuo-ku Osaka, 541-0045, Japan |
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Abstract: | The development of the microstructure of mechanical-deformation-induced Sn whiskers on electroplated films has been examined
using a focused ion beam system (FIB). The 6-μm-thick matte Sn films were compressed by using a ZrO2 ball indenter under ambient conditions. After compression, tin whiskers and small nodules were found adjacent to, and several
grains further away from, the indents. The cross-sectional microstructures of the indents and whiskers indicate that the lateral
boundaries of the newly created grains caused by recrystallization are the main routes for stress relaxation. |
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Keywords: | Sn whiskers FIB microstructure grain-boundary diffusion |
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