宇航电子产品等离子清洗技术研究

宇航电子产品、厚膜混合集成电路由于尺寸小、电路密集、焊盘间距小、装配密度高等特点,在装联过程中引入的微小污染物和氧化物,会对键合性能、电性能等造成恶劣影响,从而影响了长期可靠性。等离子清洗有别于传统的超声、机械清洗,具有无损伤、无振动的特点。本文主要针对星载厚膜模块的等离子清洗工艺进行说明,并且对清洗效果进行评价和分析。

Plasma Cleaning of Space-Borne Hybrid Integrated Circuits: An Experimental Study

A novel plasma cleaning technique was developed to clean the space-borne thick film modules, comprising, but not limited to the hybrid integrated circuits (HIC), electronic components, thick-film substrate, heat-sink and wire connections.The influence of the plasma cleaning conditions on the cleanness, mechanical behavior, electronic properties and reliability of the plasma cleaned modules was investigated with X-ray imaging, water contact angle measurement and bonding strength evaluation.The results show that the newly-developed plasma cleaning well satisfies the stringent requirements of the space-borne thick film modules.Besides, the novel plasma cleaning technique outperforms the conventional cleaning methods, including chemical cleaning, ultra-sonic cleaning and mechanical cleaning, because of higher reliability, better cleanliness, non-destruction, vibration free and little damage.