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Diffusion controlled stress rupture of polycrystalline materials
Authors:R J Charles
Affiliation:1. Ceramics Branch, Research and Development Center, General Electric Company, P. O. Box 8, 12301, Schenectady, NY
Abstract:The high temperature stress rupture process in polycrystalline solids is examined in terms of grain boundary parting by vacancy condensation at the tip of a crack within the boundary. The gradient for diffusion of these defects is considered in the model to arise from the stress gradient in advance of the flaw tip. A rupture stress function is derived which is shown to closely describe the stress rupture behavior of a number of metals and high temperature alloys.
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