| 印制线路板CAF失效研究 |
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| 引用本文： | 胡梦海,陈蓓. 印制线路板CAF失效研究[J]. 印制电路信息, 2012, 0(4): 79-83 |
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| 作者姓名： | 胡梦海 陈蓓 |
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| 作者单位： | 深圳市兴森快捷电路科技股份有限公司,深圳南山,518054 |
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| 摘 要： | 阳极导电丝(CAF)是PCB业内近十年来较为热门的可靠性问题之一,当PCBA工作在高温高湿的环境下时,有可能产生沿玻璃纤维生长的阳极导电丝CAF。本文主要以某种典型板材为例,从某板材在不同孔壁间距、不同外加偏压下的CAF性能考察入手,研究CAF产生的机理,并通过模型推算板材在不同外加偏压下的平均失效寿命(MTF),为后续其他板材耐CAF性能的考察提供了理论依据和试验基础。
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| 关 键 词： | 阳极导电丝CAF 电化学迁移 水解 平均失效时间 Bell Labs模型 可靠性 |
Conductive anodic filament failure investigation of PCB |
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| HU Meng-hai,CHEN Bei. Conductive anodic filament failure investigation of PCB[J]. Printed Circuit Information, 2012, 0(4): 79-83 |
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| Authors: | HU Meng-hai CHEN Bei |
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| Affiliation: | HU Meng-hai CHEN Bei |
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| Abstract: | Conductive anodic filament(CAF) is one of the most popular PCB reliability problems these years.While PCBA is working in the environment of high temperature and humidity,CAF may grow through the fiber.This article gained the MTF of PCBs which use a typical material with different hole space and bias voltage.The CAF growth mechanism is investigated.The MTF of this material in different bias voltage is calculated by Bell Lab model and compared with the data gained by experiment.This article provides a theory and experiment basis to the future investigation. |
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| Keywords: | Conductive Anodic Filament Electrochemistry migration Hydrolyze MTF Bell Labs Models Reliability |
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