| 高性能非银导电胶粘剂研究及应用 |
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| 引用本文： | 虞苏玮,安维丹.高性能非银导电胶粘剂研究及应用[J].电子工艺技术,1997,18(1):34-38,39. |
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| 作者姓名： | 虞苏玮 安维丹 |
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| 作者单位： | 电子工业部第二研究所 |
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| 摘 要： | 介绍了ＧＳＤ－Ｔ型铜粉导电胶粘剂各组分的选择，特殊铜粉的制备、配方和使用工艺条件，还列举了各种性能的测试数据。该导电胶粘剂在电子产品和厢式通信车上得到了初步应用。能满足使用要求。为电子产品的导电连接的通信车的电磁屏蔽提供了一种新的材料。
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| 关 键 词： | 导电 铜粉 环氧树脂 胶粘剂 |
The Tesearch and Application of the High-PerformanNon-Siliver Electric Conductive Adhesive |
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| Yu Suwei,An Weidan,Ou Meng,Li Gang.The Tesearch and Application of the High-PerformanNon-Siliver Electric Conductive Adhesive[J].Electronics Process Technology,1997,18(1):34-38,39. |
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| Authors: | Yu Suwei An Weidan Ou Meng Li Gang |
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| Affiliation: | Yu Suwei An Weidan Ou Meng Li Gang |
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| Abstract: | Introduces selection of component in GSD_T type copper powder electric conductive adhesive,preparation of specific copper powder,compounding and condiction of processing.It enumerates meterage date of some property.The electric conductive adhesive is preliminary applied to electric product and cabinet communicative vehicle,satisfied with used condiction.It provides a new meterial for condutive connection of electric product and electromaganetic shielding. |
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| Keywords: | Electric conductive Copper powder Epoxy resin Adhesive |
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