| 毫米波微带键合金丝互连模型的研究 |
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| 引用本文： | 徐鸿飞,殷晓星,孙忠良.毫米波微带键合金丝互连模型的研究[J].电子学报,2003,31(Z1):2015-2017. |
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| 作者姓名： | 徐鸿飞 殷晓星 孙忠良 |
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| 作者单位： | 东南大学毫米波国家重点实验室, 江苏, 南京, 210096 |
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| 摘 要： | 本文应用神经网络方法、采用FDTD全波分析结果作为训练样本得到了毫米波微带键合金丝互连的参数模型.这个神经网络模型可以指导毫米波集成电路的设计,利用该模型可以得到不同拱高、微带间隙和频率时的电路散射参数.实验测试了键合金丝互连的散射参量并与神经网络模型的结果进行了比较分析.
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| 关 键 词： | 微带互连 神经网络 时域有限差分 |
| 文章编号： | 0372-2112(2003)12A-2015-03 |
| 收稿时间： | 2003-10-25 |
| 修稿时间： | 2003年10月25 |
On the Model of Microstrip Bonding Wire Interconnects for Millimeter Wave Applications |
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| XU Hong-fei,YIN Xiao-xing,SUN Zhong-liang.On the Model of Microstrip Bonding Wire Interconnects for Millimeter Wave Applications[J].Acta Electronica Sinica,2003,31(Z1):2015-2017. |
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| Authors: | XU Hong-fei YIN Xiao-xing SUN Zhong-liang |
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| Affiliation: | State Key Lab of Millimter Waves, Southeast University, Nanjing, Jiangsu 210096, China |
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| Abstract: | A model of microstrip bonding wire interconnects for millimeter wave applications is presented, which is based on neural network methods.The results from a FDTD full-wave algorithm have been used in the learning procedures of the neural network.The model can be applied to the design of millimeter wave integrated circuits.The scattering parameters of the bonding wire, which are related with the gap between microstrips, the height of bonding wires and the operating frequency, have been simulated by the neural network model.The scattering parameters of a bonding wire interconnect has been measured and compared with the results from the neural network model. |
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| Keywords: | microstrip interconnection neural network FDTD |
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