Pyrex 7740玻璃深刻蚀掩模研究

玻璃湿法深刻蚀掩模常采用低压化学气相沉积(LPCVD)多晶硅、Cr/Au金属层+光刻胶等,但往往会在玻璃中引入应力,影响后期应用(如阳极键合),而且Cr/Au金属层价格昂贵。为避免以上缺点,引入了SX AR—PC 5000/40保护胶+WBR2075干膜作为玻璃的刻蚀掩模,在HF︰NH4F,HF︰HCl,HF︰HCl︰NH4F刻蚀溶液中进行了大量实验。实验结果表明:SX AR—PC 5000/40抗腐蚀能力强,且成功实现了对Pyrex 7740玻璃131μm的深刻蚀。整个工艺过程与IC工艺兼容,可以进行圆片级批量加工。实验结果对圆片级封装和其他MEMS器件的制作有一定参考作用。

Research on pyrex 7740 glass deep etching mask

Glass wet deep etching mask often uses LPCVD poly-silicon or Cr/Au metal layer combined with photoresist ,which will induce stress in glass and affect the late application such as anodic bonding. Besides, Cr/Au is expensive. In order to avoid above shortcomings, protective coating SX AR-PC 5000/40 combined with WBR2075 dry film is introduced as a new etching mask. Lots of experiments are investigated in HF ： NH4 F, HF： HCl,HF： HCl： NH4F etching solution. It is shown by the experiments that SX AR-PC 5000/40 has strong resistance to corrosion,and deep etching on pyrex7740 glass of depth of 131 μm is obtained. The whole process is compatible with standard IC process and can be batch fabricated at wafer-level. Experimental result has reference function for fabrication of some MEMS device, and wafer-level package.