| 化合物半导体材料制片技术探讨 |
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| 引用本文： | 李金良. 化合物半导体材料制片技术探讨[J]. 半导体光电, 1989, 10(3): 74-78 |
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| 作者姓名： | 李金良 |
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| 作者单位： | 重庆光电技术研究所 |
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| 摘 要： | 本文主要探讨化合物半导体材料磨片、抛光工艺中与表面质量有光的因素,并对一些不利因素提出了改进措施。
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| 关 键 词： | 化合物 半导体 材料 制片技术 |
Study of the Techniques of Compound Semiconductor Wafers Process |
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| Li Jinliang Chongqing Optoelectronics Research Institute. Study of the Techniques of Compound Semiconductor Wafers Process[J]. Semiconductor Optoelectronics, 1989, 10(3): 74-78 |
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| Authors: | Li Jinliang Chongqing Optoelectronics Research Institute |
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| Affiliation: | Li Jinliang Chongqing Optoelectronics Research Institute |
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| Abstract: | The factors associated with surface quality for grinding and poli- shing compound semiconductor wafers are studied,and improving means to eliminate some unfavourable factors arc presented as well. |
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| Keywords: | compound Semiconductors Techniques of wafer process |
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