SOC设计中的浮动压焊块电源/地线网络设计和优化

随着VLSI工艺技术的发展和芯片规模的不断增加，尤其是在SOC设计中，原有的那种供电压焊块只能位于芯片边缘的确定益的模式已经不能够满足整个电路性能的需要。在很多情况下，依靠在电源线的拓扑结构确定后的线宽优化，还是无法保证在有限的布线资源下为电路提供可靠的高性能的供电需求。由此，出现了在芯片边缘上浮动放置压焊块及在芯片的顶部放置供电压焊块阵列的方法。文中提出了一种用于SOC设计中新的基于树型结构的浮动压焊块的电源／地线网络优化算法，经过MCNC电路实例测试后得到明显的优化结果。

Design and Optimization of Floating PAD in Power/Ground Network for SOC

With the fast development of VLSI technology and rapid increase of scale of chip, especially in the design of SOC, the original pattern of placing all PADs on predefined positions is infeasible to ensure high-quality power supply to each individual circuit blocks. In many cases, post-floor planning power supply optimization is also unable to guarantee high-quality power supply under limited routing resources. Therefore, a new pattern that PADs are arranged to be put on any position all around the chip or even on the top of modules comes forth. In this paper, we present a method to allocate optimal floating PADs in tree-mode. Testing with examples of MCNC, we find the result of optimization is evident.