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The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test |
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| Authors: | Christine Jill Lee Wei-Yu Chen Tzu-Ting Chou Tae-Kyu Lee Yew-Chung Wu Tao-Chih Chang Jenq-Gong Duh |
| Affiliation: | 1. Department of Materials Science and Engineering, National Tsing Hua University, No. 101, Sect.?2, Kuang-Fu Road, Hsinchu, 30013, Taiwan 2. Component Quality and Technology Group, Cisco Systems, Inc., San Jose, CA, 95134, USA 3. Department of Material Science and Engineering, National Chiao Tung University, Hsinchu, 30010, Taiwan 4. Industrial Technology Research Institute, Hsinchu, 31040, Taiwan |
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| 本文献已被 SpringerLink 等数据库收录！ | |