Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis |
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| Authors: | Ming-Chih Yew Chan-Yen Chou Kuo-Ning Chiang |
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| Affiliation: | aAdvanced Microsystem Packaging and Nano-Mechanics Research Laboratory, Department of Power Mechanical Engineering, Advanced Packaging Research Center, National Tsing Hua University, HsinChu, Taiwan |
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| Abstract: | The stress buffer layer (SBL) is a widely applied improvement in many advanced packages used to release the stress concentration at solder joints. However, it has been generally found that the metal line adjacent to the SBL may suffer larger deformation and its reliability should be addressed. In this study, the panel level package (PLP) technology with solder on polymer (SOP) structure is selected as the testing sample to investigate the effect of SBL. The ball shear strength test is conducted first to investigate the reliability of metal trace in PLP. In addition, finite element (FE) analysis is applied to understand the actual thermo-mechanical behavior of PLP after its assembly. The package-level and board-level reliability assessments are compared, and the suggested layout of the redistribution layer on the SBL is provided herein. |
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