应用于红外读出电路的LVDS接收电路设计

在大规模红外读出电路中，接口电路的数据传输效率及接口数量尤为关键。传统接口电路采用并行接口进行数据传输，这种方式会占用较多的芯片引脚。为了提升数据的传输效率，设计了一款用于数据接收的3通道串行低压差分信号(Low Voltage Differential Signaling, LVDS)接口电路。电路采用0.18um互补金属氧化物半导体(Complementary Metal Oxide Semiconductor, CMOS)工艺设计。仿真结果表明，LVDS接口电路在400 MHz频率下，能够将2路接收端数据转换为8路数据并将其输出给内部数字处理单元。与传统并行接口相比，本电路节省了6个数据传输引脚，大大提高了数据传输效率。

Design of LVDS Receiver Circuit Used in Infrared ROIC

In large-scale infrared readout integrated circuits (ROIC), the data transfer efficiency and the number of interface circuits are particularly crucial. Traditional interface circuits use parallel interfaces for data transmission, which takes up a significant amount of chip pins. In order to improve the efficiency of data transmission, a 3-channel serial low voltage differential signaling (LVDS) interface circuit is designed for data reception. The circuit adopts a 0.18 μm complementary metal oxide semiconductor (CMOS) process. The simulation results show that the LVDS interface circuit can convert 2-channel receiver data into 8-channel data at a frequency of 400 MHz and output it to the internal digital processing unit. Compared with traditional parallel interfaces, this circuit saves 6 data transmission pins, greatly improving data transmission efficiency.