芯片用金刚石增强金属基复合材料研究进展

随着电子设备集成化程度越来越高，对高导热封装材料的需求也越来越大，金刚石增强金属基复合材料凭借其高导热性能成为研究焦点。然而，由于金刚石颗粒与金属基体之间的不润湿特性，具有高导热性的金刚石增强金属基复合材料难以制备。文中综述了金刚石增强金属基复合材料的研究进展，包括界面改性、工艺参数优化和复合材料制备方法，并指出了金刚石增强金属基复合材料目前存在的问题和今后的研究方向。

Research Progress of Diamond-reinforced Metal Matrix Composites

With the increasing integration of electronic devices, the requirement for packaging materials with high thermal conductivity has been growing. Diamond-reinforced metal matrix composites have become a research focus due to their excellent thermal conductivity. However, the challenge lies in the poor wettability between diamond particles and the metal matrix, which makes it difficult to fabricate the diamond-reinforced metal matrix composites with high thermal conductivity. An overview of the research progress in diamond-reinforced metal matrix composites is presented in this paper, including interface modification, optimization of process parameters and composite material fabrication methods. And the current problems and future research directions of diamond-reinforced metal matrix composites are discussed.