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纳米级CMOS集成电路的发展状况及辐射效应
引用本文:刘忠立. 纳米级CMOS集成电路的发展状况及辐射效应[J]. 太赫兹科学与电子信息学报, 2016, 14(6): 953-960
作者姓名:刘忠立
作者单位:a.Institute of Microelectronics,CAS,Beijing 100029,China;b.Institute of Semiconductors,CAS,Beijing 100083,China
摘    要:
介绍互补金属氧化物半导体(CMOS)集成电路的发展历程及纳米级CMOS集成电路的关键技术,在此基础上研究了纳米级CMOS集成电路的辐射效应及辐射加固现状。研究结果表明,纳米级FDSOICMOS集成电路无需特殊的加固措施,却比相同技术代的体硅CMOS集成电路有好得多的辐射加固能力,特别适用于空间应用环境。

关 键 词:纳米级互补金属氧化物半导体集成电路;器件沟长;辐射效应
收稿时间:2015-07-10
修稿时间:2015-08-17

Development of nano scale CMOS integrated circuit and its radiation effects
LIU Zhongli. Development of nano scale CMOS integrated circuit and its radiation effects[J]. Journal of Terahertz Science and Electronic Information Technology, 2016, 14(6): 953-960
Authors:LIU Zhongli
Abstract:
The development of Complementary Metal Oxide Semiconductor(CMOS) integrated circuit and the key technologies of nanometer scale CMOS integrated circuit are introduced. Based on this, the radiation effects and the current status of radiation hardening for nano scale CMOS integrated circuit are studied. The research shows that the nano scale FDSOICMOS integrated circuit bears a better radiation hardening ability than the same technology generation of bulk silicon CMOS integrated circuit, and it is especially suitable for the application of space technology.
Keywords:
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