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等离子体加工光学元件工艺研究
引用本文:王颖男,杭凌侠,胡敏达. 等离子体加工光学元件工艺研究[J]. 表面技术, 2008, 37(1): 51-53
作者姓名:王颖男  杭凌侠  胡敏达
作者单位:西安工业大学薄膜技术与光学检测重点实验室,陕西,西安,710032;西安工业大学薄膜技术与光学检测重点实验室,陕西,西安,710032;西安工业大学薄膜技术与光学检测重点实验室,陕西,西安,710032
摘    要:为了得到超光滑表面且无表层损伤的光学元件,引入一种新型的超光滑表面加工技术--等离子体抛光.介绍了有关等离子体刻蚀的研究进展以及去除机理,在已经设计好的实验平台上进行等离子体加工工艺实验,对影响去除效果的参数进行了实验研究,最后进行工艺参数优化.结果表明此技术能够应用于对光学元件的加工.

关 键 词:超光滑表面  等离子体抛光  电容耦合放电  表面粗糙度  去除速率
文章编号:1001-3660(2008)01-0051-03
收稿时间:2007-10-23
修稿时间:2007-10-23

Super Smooth Surface Fabrication Processes-plasma Etching
WANG Ying-nan,HANG Ling-xia and HU Min-da. Super Smooth Surface Fabrication Processes-plasma Etching[J]. Surface Technology, 2008, 37(1): 51-53
Authors:WANG Ying-nan  HANG Ling-xia  HU Min-da
Affiliation:Thin Film Technology and Optical Test Open Key Laboratory, Xian Technological University, Xian 710032, China,Thin Film Technology and Optical Test Open Key Laboratory, Xian Technological University, Xian 710032, China and Thin Film Technology and Optical Test Open Key Laboratory, Xian Technological University, Xian 710032, China
Abstract:A novel super smooth surface fabrication technology of plasma polishing was introduced. Progress and the mechanism of etching in the development of plasma etching processes were reviewed. Plasma polishing on designed plasma technology stage, the parameters that affect the etching results were studied by experiment,the optimal technological parameters were obtained.
Keywords:Super smooth surface   Plasma polishing   Capacitivcly-coupled discharge   Roughness of surface  Remove rate
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