微波多层板共晶烧结翘曲变形数值计算

针对微波多层板叠层复合材料共晶烧结翘曲变形问题,对共晶烧结升温、降温阶段的数值计算方法进行了研究。采用ANSYS Workbench 协同仿真平台,在 ACP(ANSYS Composite Pre)模块中建立了微波多层板的叠层结构,采用顺序耦合方法计算了共晶烧结升温及降温阶段的变形累积效果。计算结果表明:微波多层板与铝壳体共晶烧结完成后,形成以焊接面为中心的向上翘曲变形,在壳体烧结面尺寸 120 mm × 40 mm下,Z向最大变形量为0.181 mm。 仿真计算结果与实测数据吻合良好,验证了微波 多层板共晶烧结过程翘曲变形数值计算的正确性,为微波多层板共晶烧结翘曲变形分析及优化设计提供了参考。

Numerical Simulation of Warpage Deformation for Microwave Multilayer Boards during Vacuum Eutectic Sintering

Aiming at the warpage deformation of microwave multilayer boards composites during the vacuum eutectic sintering process, the numerical simulation during the heating and cooling stages of the vacuum eutectic sintering process is studied. Based on ANSYS Workbench co-simulation platform, the laminated structure of the microwave multilayer boards is established in ACP (ANSYS Composite Pre). The deformation accumulation of the vacuum eutectic sintering during heating and cooling stages is calculated with the sequential coupling method. The results show that an upward convex deformation is formed centering on the welding surface after the vacuum eutectic sintering process of the microwave multilayer boards and the maximum deformation in Z direction is 0.181 mm when the sintering surface size of shell is 120 mm × 40 mm. The calculation results are in good agreement with the measured data, which verifies correctness of the numerical calculation of the warpage deformation for microwave multilayer boards in the process of the vacuum eutectic sintering and provides a reference for the analysis and optimization design of warpage deformation of microwave multilayer board composites during the vacuum eutectic sintering process.