| 镀铜厚度对裸铜框架抗氧化性能的影响 |
| |
| 引用本文： | 张胡军,张进兵,安飞,雷育恒,温莉,刘殿龙,李习周. 镀铜厚度对裸铜框架抗氧化性能的影响[J]. 电子与封装, 2013, 0(1): 9-11,16 |
| |
| 作者姓名： | 张胡军 张进兵 安飞 雷育恒 温莉 刘殿龙 李习周 |
| |
| 作者单位： | 天水华天科技股份有限公司 |
| |
| 摘 要： | 采用双臂电桥法测量了不同氧化程度的裸铜框架的电阻,在此基础上分析了烘箱内氧浓度、烘烤温度和框架表面镀铜厚度对框架氧化程度的影响。研究发现,在氧浓度≤0.1%的氮气保护环境中,经过180℃烘烤60 min后,裸铜框架的氧化程度大于无氮气保护下100℃烘烤60 min后的氧化程度;镀铜层能有效提高裸铜框架在100~180℃范围内的抗氧化能力,镀铜层较厚(1.0μm)的裸铜框架的抗氧化能力优于镀铜层较薄(0.5μm)的裸铜框架的抗氧化能力。
|
| 关 键 词： | 裸铜框架 双臂电桥 电阻 镀铜厚度 |
Effect of the Thickness of Copper Coating on the Oxidation Resistance of Bare-copper Leadframes |
| |
| ZHANG Hujun,ZHANG Jinbing,AN Fei,LEI Yuheng,WEN Lijun,LIU Dianlong,LI Xizhou. Effect of the Thickness of Copper Coating on the Oxidation Resistance of Bare-copper Leadframes[J]. Electronics & Packaging, 2013, 0(1): 9-11,16 |
| |
| Authors: | ZHANG Hujun ZHANG Jinbing AN Fei LEI Yuheng WEN Lijun LIU Dianlong LI Xizhou |
| |
| Affiliation: | (Tianshui huatian technology Co.,LTD,Tianshui 741000,China) |
| |
| Abstract: | In this paper, using double bridge method, the resistances of bare-copper leadframes with different degrees of oxidation were measured. Based on these measurements, effects of oxygen concentration, baking temperature and thickness of copper coating on oxidation of bare-copper leadframe were studied. This study results show that the oxidation of bare-copper leadframe were baked at the temperature of 180 ℃ for 60 min under oxygen concentration of 0.1% within Nitrogen environment is more serious than which was caused by baking at the temperature of 100℃ for 60 min under atmosphere. Moreover, copper coating can effectively improve the oxidation resistance of bare-copper leadframe at the range of 100-180 ℃, and the oxidation resistance of bare-copper leadframe with 1.0 μm copper coating is superior to that of another bare-copper leadframe with 0.5μm copper coating. |
| |
| Keywords: | bare-copper leadframe double bridge resistances thickness of copper coating |
| 本文献已被 CNKI 维普 等数据库收录！ |
|
