| 不流动半固化片特性的探讨 |
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| 引用本文： | 刘榕健,郑军,郑英东.不流动半固化片特性的探讨[J].印制电路信息,2013(10):15-19. |
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| 作者姓名： | 刘榕健 郑军 郑英东 |
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| 作者单位： | 广东生益科技股份有限公司,广东东莞523139 |
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| 摘 要： | 随着刚挠板、阶梯板与金属基散热板需求量的增大，作为连接材料的不流动半固化的使用量增多。不流动半固化片与普通FR-4半固化片、纯胶片有很大的差别，苓丈结合实验验证，详细分析了不流动半固化片的测试指标、流动性等特性，为不流动半固化片的加工提供了若干建议。
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| 关 键 词： | 不流动 低流动 半固化片 连接 |
The features of No-Flow prepreg discussion |
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| Affiliation: | LIU Rong-jian ZHEN Jun ZHEN Ying-dong |
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| Abstract: | As rigid-flexible board and metal base plate demand increased, the usage of No-Flow prepreg increased. No-Flow prepreg is very different with normal FR-4 and bonding sheet. Combining with the experimental verification, this article analyzes the features of No-Flow prepreg in detail, such as test indicators, liquidity, etc. And give several effective suggestions in No-Flow prepreg processing. |
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| Keywords: | No-Flow Low-Flow Prepreg Connection |
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