| 聚四氟乙烯平面埋电阻台阶式多层板制造技术研究 |
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| 引用本文： | 杨维生. 聚四氟乙烯平面埋电阻台阶式多层板制造技术研究[J]. 印制电路信息, 2007, 0(6): 40-46 |
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| 作者姓名： | 杨维生 |
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| 作者单位： | 南京电子技术研究所,江苏,南京,210013 |
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| 摘 要： | 目前来说,通讯用陶瓷粉填充、玻璃短纤维增强的聚四氟乙烯微波多层印制电路板的制造技术越来越显现出其重要性,文中对平面电阻印制板的制造工艺流程进行了简单的介绍,对聚四氟乙烯埋电阻台阶式多层微波印制板制造所采用的工艺技术进行了较为详细的论述。
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| 关 键 词： | 聚四氟乙烯 平面埋电阻 多层板 |
| 文章编号： | 1009-0096(2007)06-0040-07 |
Study on Processing Technology of Step Designed Planar Buried Resistor PTFE Multilayer Printed Circuit Board |
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| Yang Weisheng. Study on Processing Technology of Step Designed Planar Buried Resistor PTFE Multilayer Printed Circuit Board[J]. Printed Circuit Information, 2007, 0(6): 40-46 |
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| Authors: | Yang Weisheng |
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| Affiliation: | Yang Weisheng |
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| Abstract: | Recently,the fabrication technology of the microwave multilayer printed circuit board of the glass microfiber reinforced polytetrafluoetylene with ceramic particles filled composite applied for communication was very important.The fabrication of the planar buried resistant printed circuit board was briefly introduced.The possibility and utility of the processing technology of the step designed planar buried resistant PTFE microwave multilayer printed circuit board were also illuminated. |
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| Keywords: | PTFE planar buried resistant multilayer printed circuit board |
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