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聚酰亚胺树脂研究与应用进展
引用本文:李敏,张佐光,仲伟虹.聚酰亚胺树脂研究与应用进展[J].复合材料学报,2000,17(4):48-53.
作者姓名:李敏  张佐光  仲伟虹
作者单位:北京航空航天大学材料科学与工程系,北京10083
基金项目:国家自然科学基金!重点资助项目 (5 89833110 )
摘    要:聚酰亚胺树脂是一种耐热性高、介电性能优异、机械强度良好的高分子材料。本文中主要介绍了聚酰亚胺树脂近几年的研究与应用进展情况。包括: 用新的合成方法引入特征元素或基团, 制备出性能优异或具有某种特色功能的新型聚酰亚胺树脂; 聚酰亚胺树脂在复合材料中的应用进展; 聚酰亚胺树脂在微电子工业中的应用进展;并且提出了聚酰亚胺树脂的发展方向。

关 键 词:聚酰亚胺  复合材料  微电子  树脂基体
收稿时间:2000-04-30
修稿时间:2000-05-16

STUDY AND APPLICATION DEVELOPMENT OF POLYIMIDES
LI Min,ZHANG Zuo-guang,ZHONG Wei-hong,PAN Yi-shan.STUDY AND APPLICATION DEVELOPMENT OF POLYIMIDES[J].Acta Materiae Compositae Sinica,2000,17(4):48-53.
Authors:LI Min  ZHANG Zuo-guang  ZHONG Wei-hong  PAN Yi-shan
Affiliation:Dept of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083,China
Abstract:WT5,5”BZ]Polyimides have excellent thermal stability, outstanding mechanical and good dielectric performance. Recently, many new kinds of polyimides have been developed. The study and development of polyimides are summarized in this paper. Polyimides with unique properties can be achieved by introducing special structures. Carbon fiber/polyimide composites for application to aerospace possess some unique characteristics including resistance to high temperature, high specific modulus and high specific strength. Besides, the utilization of polyimides in microelectronic industry is included.
Keywords:polyimide  composite  microelectronic  polymer matrix  
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