The effect of annealing on residual stress and dislocation propagation in silicon slices with damaged layer induced by scribing

The effect of annealing on residual stress and dislocation propagation in silicon slices with a damaged layer induced by diamond scribing, laser scribing and diamond blade cutting was studied by infra-red photoelastic measurements and dislocation pit observations. Residual stress and dislocation propagation both showed clear annealing temperature dependence at temperatures above 500° C, although the residual stress was greatly reduced by a small degree of dislocation propagation. The experimental results can be explained using the stress recovery theory by the model of the damaged layer with a mosaic crystal layer and a single crystal layer with micro-cracks and dislocations.