防静电工作表面：发展和历史（四）

直到20世纪50年代，电子设备和元件还是相当粗糙的系统，很少用到静电防护。它们能吸收很大的电荷而没有太大的电压提升，这种情况随着20世纪60年代初集成电路的发展而发生了根本的改变。紧随这些早期的集成电路之后的是各种薄膜器件和更密集更小的集成电路。薄膜电路和集成电路对静电放电敏感，原因是由于它们物理和电质量小和其不能承受低至100V过压的缺陷，据报道，一些较新的芯片能被低于10V的电压毁坏。也同时出现了另一个根本的改变——合成塑料的广泛使用，可以维持1000V或更高的静电电荷集结。确实，这样的值目前在塑料包装和工作表面上经常观测到，对付静电和抑制其对电子元件损坏能力需要电子设备制造商和用户长期保持警惕。

ESD Work Surfaces：Developments and History

Until the 1950s, electronic devices and components were fairly rugged systems that required little ESD protection. They could absorb a fairly large charge without serious voltage rise. This situation changed radically with the development of the integrated circuit in the early 1960s. These early IC were soon followed by- a large variety of thin film devices and ever denser and smaller IC. Thin film circuits and IC are susceptible to ESD damage due to their small physical and electrical mass and their inherent inability to withstand overvoltages as low as 100V. Reportedly, some newer chips can be damaged by as little as 10V. Another radical change has also occurred at the same time-the widespread use of synthetic plastics which can sustain static charge buildup of 1000 volts or more. Indeed, such values are now routinely observed on plastic packaging and work surfaces. Coping with static electricity, and inhibiting its ability to damage many electronic components now requires constant vigilance by manufacturers of electronic devices and users alike.