| 电子封装用Sip/Al复合材料的微观组织 |
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| 引用本文： | 刘晓艳,于家康. 电子封装用Sip/Al复合材料的微观组织[J]. 热加工工艺, 2008, 37(2): 13-16 |
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| 作者姓名： | 刘晓艳 于家康 |
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| 作者单位： | 西北工业大学,凝固技术国家重点实验室,陕西,西安,710072 |
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| 摘 要： | 用气压浸渗法制备了Sip/Al复合材料,并对所制备的复合材料的微观组织进行了研究.光学显微镜观察显示,复合材料中硅颗粒分布组织均匀、致密,有少量的孔隙存在.SEM EDS分析发现,Si颗粒有少量的溶解,并且在溶解的Si颗粒表面有氧化物界面层生成.XRD分析结果表明,在复合材料界面中没有金属间化合物的生成.
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| 关 键 词： | 压力浸渗 复合材料 微观组织 界面 电子封装 |
| 文章编号： | 1001-3814（2008）02-0013-04 |
| 收稿时间： | 2007-09-21 |
| 修稿时间： | 2007-09-21 |
Study on Microstructure of Sip/Al Composite Applied to Electronic Packaging |
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| LIU Xiaoyan,YU Jiakang. Study on Microstructure of Sip/Al Composite Applied to Electronic Packaging[J]. Hot Working Technology, 2008, 37(2): 13-16 |
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| Authors: | LIU Xiaoyan YU Jiakang |
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| Abstract: | Silicon particle reinforced Al-base composite was fabricated by gas pressure infiltration techniques, and microstructure of the composite was investigated. The results show that the distribution of silicon particles in the composite is uniform and compact through optical microscope examination, but few porosities exist in composite. It has been found that some silicon particles are dissolved and new oxide interface is formed in the surface of the original particles observed by SEM combine with EDS analysis. XRD examination indicates that no intermetallic compound is formed in the composite. |
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| Keywords: | gas pressure infiltration composite microstructure interface electronic packaging |
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