金铜双金属表面增强拉曼散射基底的制备及应用

双金属材料结合了两种金属的特性从而获得远超单一金属的性能，因而在材料应用领域获得了广泛关注。如何以低成本获得高性能功能性材料是双金属推广应用的关键。以Cu30Mn70合金片材为前驱体，采用自由腐蚀和化学电镀两步法制备了金包铜纳米多孔基底(Au@NPC)。金包覆层在有效抑制铜在空气中氧化的同时，减小了韧带间孔径距离，进一步增大了紧邻韧带间的电磁耦合效应,使Au@NPC具有更强的局域电磁场增强特性，表现出优于纳米多孔铜的表面增强拉曼散射活性。金铜双金属材料可用作表面拉曼增强散射基底，具有优异的稳定性和较低的成本。

Preparation and application of Au-Cu bimetallic surface-enhanced Raman scattering substrate

Bimetallic materials combine the characteristics of two kinds of metal and exhibit superior properties, which is widely concerned in the field of material applications. Preparing high performance functional materials at low cost is the key to the promotion and application of bimetal. Using Cu₃₀Mn₇₀ alloy as precursor, gold coated nanoporous copper substrate (Au@NPC) was fabricated by free corrosion and subsequent chemical plating. In addition to limiting the oxidation of copper in air, the gold coating reduces the aperture distance between ligaments, increases the electromagnetic coupling effect between adjacent ligaments, and make Au@NPC have stronger local electromagnetic field enhancement characteristics, which is better than the surface enhanced Raman scattering characteristics of nanoporous copper. Gold-copper bimetallic materials can be used as surface Raman enhanced scattering substrates with excellent stability at low cost.