基于ANSYS Workbench的光学探测系统热-结构仿真分析

热载荷是导致红外探测系统失效的主要原因之一，因此本文利用ANSYS Workbench软件对某红外成像光学探测组件进行不同温度载荷下的热-结构耦合分析。首先观察光学镜头与探测器之间后截距在不同温度载荷下的响应；然后利用光学软件ZEMAX得到后截距变化时理论上光学的成像质量；最后通过实验验证了理论计算模型，同时得到了不同温度载荷下光学探测系统的变形规律，发现探测器安装材料的热传导系数与热膨胀系数都会影响到探测系统的稳定性。本文的研究工作对红外成像光学探测系统的设计、优化以及可靠性方面具有重要的指导意义。

Simulation Analysis of Thermal-Structure of an Optical Detection System

Thermal load is one of the main reasons for the failure of infrared detection system, therefore, thermal-structure coupling analysis of a certain type of infrared imaging optical detection module under different temperature loads by means of ANSYS Workbench software was performed in this study. First, the response of the back intercept between the optical lens and the detector under different temperature loads was observed, and then, the theoretical imaging quality was calculated by the optical software ZEMAX on the basis of the back intercept. Finally, the theoretical calculation models were verified by the environment test. Simultaneously, the deformation rule of the optical detection module under different temperature loads was obtained, and it was found that the conductivity coefficient and thermal expansivity of the installation material of the detector affected the stability of the detection module. This research can provide guidance on the design, optimization, and reliability of infrared imaging optical detection modules.