| 金刚石薄膜膜基界面结合强度测量技术的研究进展 |
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| 引用本文： | 简小刚,孙方宏,赵国伟,刘国良,陈明. 金刚石薄膜膜基界面结合强度测量技术的研究进展[J]. 金刚石与磨料磨具工程, 2002, 22(3): 3-7 |
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| 作者姓名： | 简小刚 孙方宏 赵国伟 刘国良 陈明 |
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| 作者单位： | 200030,上海交通大学 |
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| 基金项目： | 国家自然科学基金资助项目 (5 0 0 0 5 013) |
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| 摘 要： | 膜基界面结合强度的测量与评价是金刚石薄膜制备与应用关键问题，本文介绍了国内外金刚石薄膜膜基界面结合强度的几种典型的测量方法，着重探讨了膜基界面结合强度的精确定量测量技术的研究现状以及发展趋势，提出了用一种新的内涨鼓泡测量法，对复杂形状基体上金刚石薄膜膜基界面结合强度进行精确定量检测，为金刚薄膜的制备工艺优化及其质量的评估提供可靠的依据和标准。
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| 关 键 词： | 金刚石薄膜 结合强度 鼓泡 测量方法 |
| 修稿时间： | 2002-01-11 |
Development of Measurements of the Adhesion Strength between Diamond Thin Films and Substrates |
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| JIAN Xiaogang et al. Development of Measurements of the Adhesion Strength between Diamond Thin Films and Substrates[J]. Diamond & Abrasives Engineering, 2002, 22(3): 3-7 |
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| Authors: | JIAN Xiaogang et al |
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| Affiliation: | JIAN Xiaogang et al |
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| Abstract: | Adhesion measurement is one of the key question for the fabrication and application of CVD diamond thin film. In this paper, some typical adhesion measurements on diamond thin films were introduced. And also, the research status and the development direction of adhesion measurements were discussed. A novel bulge-blister test was put forward for the adhesion measurement of diamond thin films deposited on complex-geometries substrate, which can give a foundation for the optimization of fabrication technics and a criterion for the evaluation on the quality of diamond thin films. |
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| Keywords: | diamond thin film adhesion strength blister test |
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