| 烧结式镍基板化学浸渍过程研究' |
| |
| 引用本文： | 唐致远,赵铭,宋改云,宋全生.烧结式镍基板化学浸渍过程研究'[J].电池,1999,29(2):57-60. |
| |
| 作者姓名： | 唐致远 赵铭 宋改云 宋全生 |
| |
| 作者单位： | 唐致远（天津大学，天津 300072）;赵铭（天津大学，天津 300072）;宋改云（天津大学，天津 300072）;宋全生（天津大学，天津 300072） |
| |
| 摘 要： | 对烧结式镍基板的真空化学浸渍过程及机理进行了研究.提出了计算浸渍量的数学式,并讨论了影响浸渍量的因素,提出解决后期浸入率下降的新方法.
|
| 关 键 词： | 化学浸渍 烧结式镍基板 氢氧化镍 |
| 修稿时间： | 1998年8月11日 |
Study of Chemical Impregnation for Sintered Nickel Plaques |
| |
| Tang Zhiyuan, Zhao Ming, Song Gaiyun, Song Quansheng.Study of Chemical Impregnation for Sintered Nickel Plaques[J].Battery Bimonthly,1999,29(2):57-60. |
| |
| Authors: | Tang Zhiyuan Zhao Ming Song Gaiyun Song Quansheng |
| |
| Abstract: | The process and mechanism of vacuum chemical impregnation were studied. The math equations for sintered Ni plaque were deduced to calculate the active material loading into the electrode. The reasons that affected the total Ni (OH)2 were discussed by analyzing the math equations. A new method was used to solve the problem that the impregnated Ni (OH)2 decreased in the late impregnation process. |
| |
| Keywords: | Chemical Impregnation Sintered Nickel Plaque Ni(OH)_2 |
| 本文献已被 CNKI 等数据库收录！ |
