大尺寸基板的大型BGA返修工艺研究

BGA封装芯片焊接工艺已很成熟,但由于其焊点位于器件本体底部,给其返修带来困难,大尺寸BGA芯片的返修难度更大,如再位于大尺寸基板之上难度就更加倍。针对大尺寸基板上的大尺寸BGA封装芯片,通过实际返修案例,从工艺参数、返修设备、治具以及操作方法等多个方面对返修工艺进行探讨。

Large Size BGA on Large PCB Repair Process Research

BGA devices have been widely used in the electronics assembly and the soldering process is also very mature, because of BGA solder joints under the body of the device, it is difficult to repair, and the large size BGA chip repair difficulty is greater. When large size BGA on large size PCB, the repair is doubly difficult. The article in view of the large size PCB and large size BGA, with the real case of repair, from the process parameters, rework equipment, fixture, and other aspects, such as operating method to study the repair process.