| 不同镀层结构的金属外壳盐雾试验分析 |
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| 引用本文： | 黄代会.不同镀层结构的金属外壳盐雾试验分析[J].微电子学,2007,37(5):685-688. |
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| 作者姓名： | 黄代会 |
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| 作者单位： | 中国电子科技集团公司,第二十四研究所,重庆,400060 |
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| 摘 要： | 集成电路外壳的抗盐雾腐蚀能力是由材料、冶金、电镀工艺及镀层结构等多种因素决定的。对三种底材的三种镀层结构进行抗盐雾对比试验,并对三种结构的失效概率进行了统计分析。结果表明,在镀层达到一定厚度后,采用镍与金的交叉镀层结构抗盐雾能力最强,最差的是镍层加金层结构的镀层外壳。
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| 关 键 词： | 集成电路外壳 金属外壳 交叉镀层 抗盐雾 |
| 文章编号： | 1004-3365（2007）05-0685-04 |
| 修稿时间： | 2007-04-03 |
Analysis of Salt Spray Experiment on Metal Case with Different Coatings |
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| HUANG Dai-hui.Analysis of Salt Spray Experiment on Metal Case with Different Coatings[J].Microelectronics,2007,37(5):685-688. |
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| Authors: | HUANG Dai-hui |
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| Affiliation: | Sichuan Institute of Solid-State Circuits, China Electronics Technology Group Corp. , Chongqing 400060, P. R. China |
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| Abstract: | Experiments were conducted on resistance of three coatings to salt spray,and a statistic analysis was made on failure probability of the three structures.The result indicated that,for certain thickness of coatings,the metal case with interleaved nickel and gold coatings has the strongest resistance to salt spray,while the structure of nickel and gold coatings has the weakest resistance. |
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| Keywords: | IC package Metal case Interleaved nickel and gold coating Salt spray resistance |
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