| 气密性陶瓷封装PIND失效分析及解决方案 |
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| 引用本文： | 郭伟,葛秋玲.气密性陶瓷封装PIND失效分析及解决方案[J].电子与封装,2007,7(11):1-4. |
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| 作者姓名： | 郭伟 葛秋玲 |
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| 作者单位： | 中国电子科技集团公司第58研究所,江苏,无锡,214035 |
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| 摘 要： | 气密性陶瓷封装腔体内的自由粒子会严重影响到器件的可靠性。减少封装腔体内自由粒子数量,提高PIND合格率是气密性封装的主要技术之一。文章就陶瓷外壳封装集成电路PIND失效进行了分析,指出其主要原因,如外壳内部有瓷颗粒、芯片边缘未脱落的硅碴(屑)、芯片边沿的粘接材料卷起、脱落的粘接材料碎片、键合丝(或尾丝)、悬伸的合金焊料、封帽飞溅的合金焊料、平行缝焊打火飞溅的焊屑等,并提出了在封装工艺过程中如何对可能产生自由粒子的因素采取有效预防措施。最终使电路的粒子碰撞噪声检测合格品率达到98%以上,达到实际应用要求。
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| 关 键 词： | PIND 噪声 自由粒子 |
| 文章编号： | 1681-1070（2007）11-0001-04 |
| 修稿时间： | 2007-09-29 |
PIND Failure Analysis of Air-tightness Ceramic Packaging and the Solutions |
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| GUO Wei,GE Qiu-ling.PIND Failure Analysis of Air-tightness Ceramic Packaging and the Solutions[J].Electronics & Packaging,2007,7(11):1-4. |
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| Authors: | GUO Wei GE Qiu-ling |
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| Affiliation: | China Electronic Technology Group Corporation No,58 Institute, Wuxi 214035, China |
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| Abstract: | Loose particles in an air-tightness ceramic packaging device cavity affected the reliability of electron- ics devices badly. Decreasing the quantity of loose particles inside a device cavity is one of the main airtightness packaging technologies, In the article, PIND failure analysis of ceramic crust packaging IC is dis- cussed and the taking effective preventive measure with possible factor of loose particles in the packaging technology process is indicated. The yield of PIND test could reach 98 percent finally and achieves actual demands. |
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| Keywords: | PIND noise loose particle |
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