| 低氰电镀光亮22K金工艺研究 |
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| 引用本文： | 郭承忠,梁成浩,杨长江. 低氰电镀光亮22K金工艺研究[J]. 电镀与涂饰, 2006, 25(8): 13-15 |
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| 作者姓名： | 郭承忠 梁成浩 杨长江 |
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| 作者单位： | 大连理工大学化工学院,大连,116012;大连理工大学化工学院,大连,116012;大连海事大学机电与材料工程学院,大连,116026 |
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| 摘 要： | 研究了一种低氰电镀光亮22K金工艺。探讨了工艺流程、工艺配方、操作条件、镀液中各组分的影响及镀液的维护。该工艺镀液稳定、分散能力及深镀能力好,镀层光亮,颜色鲜艳,金含量符合22K标准,适合做装饰品镀层。
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| 关 键 词： | 电镀合金 22K金 光亮 低氰 |
| 文章编号： | 1004-227X（2006）08-0013-03 |
| 收稿时间： | 2005-11-21 |
| 修稿时间： | 2005-11-212005-12-07 |
Study on low cyanide bright 22K gold plating process |
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| GUO Cheng-zhong,LIANG Cheng-hao,YANG Chang-jiang. Study on low cyanide bright 22K gold plating process[J]. Electroplating & Finishing, 2006, 25(8): 13-15 |
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| Authors: | GUO Cheng-zhong LIANG Cheng-hao YANG Chang-jiang |
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| Affiliation: | School of Chemical Engineering, Dalian University of Technology, Dalian 116012, China |
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| Abstract: | A low cyanide bright 22K gold plating process was investigated.The process flow,technological formulation,operational conditions,effects of bath's components on plating and bath maintenance were discussed.The results show that the process has features of stable solution,good throwing power and covering power,bright and good colored coating.The content of gold satisfies the 22K standard.The above process can be applied to decorative coating. |
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| Keywords: | plating alloy 22K gold bright low cyanide |
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