首页 | 本学科首页   官方微博 | 高级检索  
     


Kinetics of 4,4′-diaminodiphenylmethane curing of bisphenol-S epoxy resin
Authors:Yanfang Li  Shigang Shen  Yanfang Liu  Jungang Gao
Abstract:The kinetics of the cure reaction for a system of bisphenol-S epoxy resin (BPSER), with 4,4′-diaminodiphenylmethane (DDM) as a curing agent, were studied by means of differential scanning calorimetry (DSC). Analysis of DSC data indicated that an autocatalytic behavior showed in the first stages of the cure, with the model proposed by Kamal, which includes two rate constants, k1 and k2, and two reaction orders, m and n. Rate constants k1 and k2 were observed to be greater when curing temperature increased. The over-all reaction order, m + n, is in the range of 2.5 ∼ 3. The activation energies for k1 and k2 were 55 kJ/mol and 57 kJ/mol, respectively. Diffusion control is incorporated to describe the cure in the latter stages. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 73: 1799–1803, 1999
Keywords:bisphenol-S epoxy resin  4,4′  -diaminodiphenylmethane  cure reaction  kinetics  differential scanning calorimetry
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号