SiGe-collector trench gate insulated gate bipolar transistor fabricated using multiple target sputtering |
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Authors: | Tsugutomo Kudoh Tanemasa Asano |
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Affiliation: | Center for Microelectronic Systems, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan |
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Abstract: | A new type of trench gate IGBT (insulated gate bipolar transistor) which uses a SiGe layer for the collector is experimentally investigated. SiGe collectors with different Ge content are deposited by multiple cathode sputtering making low temperature processing possible. The change in turn-off characteristics with Ge content is also investigated. Results indicate that the use of a SiGe collector reduces the tail current at turn-off due to the reduced injection of holes to the n− drift region. |
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Keywords: | Power device Si/SiGe heterojunction SiGe collector Trench IGBT Sputtering deposition |
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