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SiGe-collector trench gate insulated gate bipolar transistor fabricated using multiple target sputtering
Authors:Tsugutomo Kudoh  Tanemasa Asano
Affiliation:Center for Microelectronic Systems, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
Abstract:A new type of trench gate IGBT (insulated gate bipolar transistor) which uses a SiGe layer for the collector is experimentally investigated. SiGe collectors with different Ge content are deposited by multiple cathode sputtering making low temperature processing possible. The change in turn-off characteristics with Ge content is also investigated. Results indicate that the use of a SiGe collector reduces the tail current at turn-off due to the reduced injection of holes to the n drift region.
Keywords:Power device   Si/SiGe heterojunction   SiGe collector   Trench IGBT   Sputtering deposition
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