| 无铅电子封装材料及其焊点可靠性研究进展 |
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| 引用本文： | 颜秀文,丘泰,张振忠. 无铅电子封装材料及其焊点可靠性研究进展[J]. 电子元件与材料, 2006, 25(3): 5-8 |
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| 作者姓名： | 颜秀文 丘泰 张振忠 |
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| 作者单位： | 南京工业大学材料科学与工程学院,江苏,南京,210009;南京工业大学材料科学与工程学院,江苏,南京,210009;南京工业大学材料科学与工程学院,江苏,南京,210009 |
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| 基金项目： | 国防科工委科研项目;南京工业大学校科研和教改项目 |
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| 摘 要： | 随着2006年7月1日RoHS法令实施的最后期限的来临,无铅焊料的研究与应用又掀起了新一轮的热潮。由于封装材料与封装工艺的改变,给焊点可靠性带来了一系列相关问题。笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述;对今后该领域的研究前景及方向进行了展望。
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| 关 键 词： | 金属材料 无铅焊料 焊点可靠性 综述 焊点缺陷 电子封装 |
| 文章编号： | 1001-2028（2006）03-0005-04 |
| 收稿时间： | 2005-10-31 |
| 修稿时间： | 2005-10-31 |
Research Progress of Lead-free Solders and Solder Joint Reliability in Electronic Packaging |
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| YAN Xiu-wen,QIU Tai,ZHANG Zhen-zhong. Research Progress of Lead-free Solders and Solder Joint Reliability in Electronic Packaging[J]. Electronic Components & Materials, 2006, 25(3): 5-8 |
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| Authors: | YAN Xiu-wen QIU Tai ZHANG Zhen-zhong |
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| Affiliation: | School of Material Science and Engineering, Nanjing University of Technology, Nanjing 210009, China |
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| Abstract: | As RoHS law will be implemented on July 1,2006, the research and application of lead-free solders become a hot problem in the world. With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability. Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed. The prospective research on directions of lead-free technology in the future are forecasted. |
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| Keywords: | metal materials lead-free solder solder joint reliability review solder joint defects electronic packaging |
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