| 化学镀Ni—B合金工艺研究 |
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| 引用本文： | 方景礼,刘莉. 化学镀Ni—B合金工艺研究[J]. 表面技术, 1989, 0(3): 1-5 |
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| 作者姓名： | 方景礼 刘莉 |
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| 作者单位： | 南京大学应用化学研究所，南京大学应用化学研究所 |
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| 摘 要： | 近年来,化学镀Ni-B合金层的优异功能特性越来越受到各国化学镀工作者的重视,但它在我国还是个空白.本文详细讨论了二甲氨基硼烷化学镀Ni-B镀液中各种成分和工艺条件对Ni-B合金沉积速度和镀层含硼量的影响,确定了柠檬酸铵做配位剂的二甲氨基硼烷化学镀Ni-B合金的最佳工艺条件。按此条件可以稳定地获得含硼量为1～5％的Ni-B镀层。
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| 关 键 词： | 化学镀 镍－硼合金 |
Studies on Electroless Ni-B Alloy Plating Using DMAB as Reducing Agent I. Technology of Electroless Ni-B Alloy Plating |
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| Fang Jing Li and Liu Li. Studies on Electroless Ni-B Alloy Plating Using DMAB as Reducing Agent I. Technology of Electroless Ni-B Alloy Plating[J]. Surface Technology, 1989, 0(3): 1-5 |
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| Authors: | Fang Jing Li and Liu Li |
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| Abstract: | Recently the attentions of electroless platers are concentrated on the excellent functional characteristics of the Ni-B alloy deposit in many couniries, but the technology of electroless Ni-B plating using dimethylaminoborane (DMAB) as the chemical reducing agent is still a blank in China. The effects of the various compositions and operating conditions of the Ni-B bath on depositing rate and boron content are researched in detail in this paper, and the optimum formula and operating conditions of the bath using DMAB as reducing agent and ammonium citrate as complexing agent have been established. The boron contents of Ni-B deposit under this conditions are 1-5%. |
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| Keywords: | Electroless plating Ni-B alloy coating |
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