基于波峰焊接的QFP和DIP焊盘的DFM研究

虽然表面安装技术已经在电子产品中占据90%的席位,但传统的波峰焊接技术在相当长的一段时间内仍会保持使用。主要研究波峰焊接工艺,重点在难度较大的1.27 mm细间距单排插针、QFP 0.5 mm间距元件的波峰焊接技术。通过对这两种元件进行特殊的焊盘设计,采用常规的波峰焊接工艺参数,以及特殊涂覆工艺相结合,对实验板进行波峰焊接,得到预期的结果。通过实验得到0.5 mm间距QFP的焊盘最佳设计,1.27 mm细间距单排插针波峰焊接的焊盘最优设计,以及表面安装元件在进行波峰焊接中,需要专门的波峰焊接的焊盘设计等结论。

DFM of Soldering Pad of QFP and DIP for Wave Soldering

Although the surface mount technology has accounted for 90% in the electronic products, the traditional wave soldering technology is still used in the future. Mainly discusses the wave soldering technology, focus on the diffcult soldering technology of single row of DIP pins with pitch 1.27 mm, and QFP with pitch 0.5 mm. The special soldering pads were designed for the two kinds of components. The normal wave soldering process parameters combining with special coating process were used to solder the experimental board, and the result is what we expected. We get the optimal pad design for QFP with pitch0.5 mm and the good pad design for single row of DIP pins with pitch 1.27 mm based on the experiment. At the same time, the experimental result shows that the special soldering pad design is needed when QFP and DIP are soldered by wave soldering.