| 高密度电子封装器件的温度分布研究 |
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| 引用本文： | 周孑民,王锡范,黄学章,WANG Xi-tao,CHEN Liu,LIU Johan. 高密度电子封装器件的温度分布研究[J]. 湖南工业大学学报, 2002, 16(6) |
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| 作者姓名： | 周孑民 王锡范 黄学章 WANG Xi-tao CHEN Liu LIU Johan |
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| 作者单位： | 1. 中南大学,能源与动力工程学院,湖南,长沙,410083
2. Chalmers,大学,产品工程系,SE-41296,Goteborg,Sweden |
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| 基金项目： | 高等学校博士学科点专项科研项目 |
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| 摘 要： | 系统封装(System In Packaging)是电子封装工艺的前沿技术。为了研究这种高密度电子封装器件的热特性,寻求提高散热速率的途径,开发了一个SIP典型器件的传热模型,模拟了器件的热传递过程和温度分布状况,探讨了各种设计参数和物性参数对温度场的影响,为进一步改善器件的热性能提供了理论依据。
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| 关 键 词： | 电子封装 温度分布 散热 |
An Investigation into the Temperature Distribution in High Density Electronics Packaging |
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| WANG Xi-tao,CHEN Liu,LIU Johan. An Investigation into the Temperature Distribution in High Density Electronics Packaging[J]. Journal of Hnnnan University of Technology, 2002, 16(6) |
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| Authors: | WANG Xi-tao CHEN Liu LIU Johan |
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| Abstract: | System In Packaging SIP is a brand-new technology of electronics packaging. In order to investigate the characteristics of this high density electronics packaging,a math-ematic model of SIP electronics is developed and used to simulate the heat transfer process and temperature distribution inside the electronics. The effects of different design and physical parameters on temperature distribution are examined by the model. Based on the simulation, the control procedure in heat transfer and the possibility for enhancing heat dispersion are discussed. |
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| Keywords: | electronics packaging temperature distribution heat dissipation |
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