| Sn-Zn-Ga-Pr钎料表面锡须的自发生长 |
| |
| 引用本文： | 叶焕,薛松柏,薛鹏,陈澄.Sn-Zn-Ga-Pr钎料表面锡须的自发生长[J].焊接学报,2012,33(4):42-44. |
| |
| 作者姓名： | 叶焕 薛松柏 薛鹏 陈澄 |
| |
| 作者单位： | 1. 南京航空航天大学材料科学与技术学院,南京210016／马里兰大学先进寿命周期工程研究中心,美国马里兰20742
2. 南京航空航天大学材料科学与技术学院,南京,210016 |
| |
| 基金项目： | 江苏省普通高校研究生科研创新计划资助项目，南京航空航天大学博士学位论文创新与创优基金资助项目，2010年江苏省企业研究生工作站资助项目 |
| |
| 摘 要： | 结合扫描电镜与电子能谱分析了稀土元素对无铅钎料显微组织的影响.结果表明,当无铅钎料中的稀土添加过量,会诱发锡须在无铅合金表面的自发生长.在向Sn-9Zn-0.5Ga基体合金中添加0.7%(质量分数)的稀土元素镨(Pr)后,仅需室温时效12 h,合金组织中的稀土相表面即发生了锡须的自发生长.随着时效时间的延长,锡须会继续长大,其最终长度可达100μm.最后对过量稀土元素添加导致锡须生长的力学原因作了初步探讨,分析认为稀土相氧化所产生的微观压应力可能为锡须的生长提供了驱动力.
|
| 关 键 词： | 无铅钎料 稀土元素 锡须 驱动力 |
| 收稿时间： | 2011/4/7 0:00:00 |
Spontaneous growth of Sn whiskers on surface of Sn-Zn-Ga-Pr solders |
| |
| YE Huan,XUE Songbai,XUE Peng and CHEN Cheng.Spontaneous growth of Sn whiskers on surface of Sn-Zn-Ga-Pr solders[J].Transactions of The China Welding Institution,2012,33(4):42-44. |
| |
| Authors: | YE Huan XUE Songbai XUE Peng and CHEN Cheng |
| |
| Affiliation: | 1(1.College of Materials Science and Technology,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;2.Center for Advanced Life Cycle Engineering,University of Maryland,College Park 20742,USA). |
| |
| Abstract: | In spite of many beneficial effects obtained from the doping of rare earth(RE) to lead-free solders,it is newly found that an exceeded addition of RE would cause a risk of Sn whisker growth in the alloys.The results indicate that with the addition of 0.7% Pr to Sn-9Zn-0.5Ga solder,many Sn whiskers spontaneously grow from the surface of Sn-Pr phases in the bulk solder exposed for 12 hours only.And the whiskers show a continuous growth with the exposure time being increased.The final longest length of the whisker can reach 100 μm,which can lead to a serious reliability problem for electronic assemblies.Finally,the mechanical reason for whisker growth is discussed. |
| |
| Keywords: | lead-free solder rare earth Sn whisker driving force |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
| 点击此处可从《焊接学报》浏览原始摘要信息 |
|
点击此处可从《焊接学报》下载全文 |
|
